Reviewing Kopin Corporation (KOPN)’s and ASE Technology Holding Co. Ltd. (NYSE:ASX)’s results

Kopin Corporation (NASDAQ:KOPN) and ASE Technology Holding Co. Ltd. (NYSE:ASX), both competing one another are Semiconductor – Broad Line companies. We will compare their dividends, analyst recommendations, profitability, risk, earnings and valuation, institutional ownership.

Valuation & Earnings

Gross Revenue Price/Sales Ratio Net Income Earnings Per Share Price/Earnings Ratio
Kopin Corporation 28.12M 4.58 26.37M -0.01 0.00
ASE Technology Holding Co. Ltd. N/A 0.00 N/A 0.31 13.16

Table 1 highlights Kopin Corporation and ASE Technology Holding Co. Ltd.’s top-line revenue, earnings per share (EPS) and valuation.


Table 2 provides Kopin Corporation and ASE Technology Holding Co. Ltd.’s net margins, return on assets and return on equity.

Net Margins Return on Equity Return on Assets
Kopin Corporation -93.78% -37.2% -32%
ASE Technology Holding Co. Ltd. 0.00% 0% 0%


Meanwhile, ASE Technology Holding Co. Ltd.?s annual dividend is $0.29 per share and it also boasts of a 7.06% dividend yield. No dividend is paid out by Kopin Corporation

Analyst Recommendations

Kopin Corporation and ASE Technology Holding Co. Ltd. Recommendations and Ratings are available on the next table.

Sell Ratings Hold Ratings Buy Ratings Rating Score
Kopin Corporation 0 0 1 3.00
ASE Technology Holding Co. Ltd. 0 0 0 0.00

Institutional & Insider Ownership

Institutional investors held 47.2% of Kopin Corporation shares and 6.32% of ASE Technology Holding Co. Ltd. shares. Kopin Corporation’s share held by insiders are 1.6%.


Here are the Weekly, Monthly, Quarterly, Half Yearly, Yearly and YTD Performance of both pretenders.

Performance (W) Performance (M) Performance (Q) Performance (HY) Performance (Y) Performance (YTD)
Kopin Corporation 0% 11.59% -9.94% -32.75% -49.84% 54.15%
ASE Technology Holding Co. Ltd. 2.51% 2.26% 1.24% -16.73% 0% 8.8%

For the past year Kopin Corporation has stronger performance than ASE Technology Holding Co. Ltd.


On 7 of the 12 factors ASE Technology Holding Co. Ltd. beats Kopin Corporation.

Kopin Corporation invents, develops, manufactures, and sells wearable technologies and display products in the United States, the Asia-Pacific, and Europe. The company’s Kopin Wearable technology includes component technologies, which can be integrated to create products and proprietary headset systems, which use voice as the primary user interface and through the use of wireless technologies can contact other users, devices, or information from the cloud. It provides components, including high density color or monochrome miniature active-matrix liquid crystal displays, liquid crystal on silicon displays, application specific integrated circuits, backlights, optical lenses, and audio integrated circuits, as well as offers headset systems. The company’s display products are used in military, consumer, electronic, and industrial products, such as thermal weapon sights, digital cameras, virtual and augmented reality gaming, training and simulation products, and metrology tools. It sells its components directly, as well as through distributors to original equipment manufacturers; and military display products directly to prime contractors of the United States government or to foreign companies. Kopin Corporation was founded in 1984 and is headquartered in Westborough, Massachusetts.

ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services (EMS) in the United States, Taiwan, Asia, Europe, and internationally. The company offers packaging services, including flip-chip ball grid array (BGA), flip-chip chip scale package (fcCSP), advanced chip scale packages (aCSP), quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, high-band package on package, and 3D chip packages; stacked die solutions in various package types; and copper wire and silver bonding solutions, as well as module-based solutions. It also provides advanced packages, including aCSP; fcCSP; flip-chip package in package, package on package, and BGA packages; hybrid, advanced single sided substrate, integrated passive device, high-bandwidth, and fan-out wafer-level packages; IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. In addition, the company offers a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and test-related services, as well as drop shipment services; and packaging, testing and shipment, and flip-chip and wafer bumping services. Further, it provides electronic manufacturing services in relation to computers, peripherals, communications, industrial, automotive, and storage and server applications; designs, assembles, manufactures, and sells electronic components and telecommunications equipment motherboards; develops, sells, and leases real estate properties; and produces substrates. The company serves customers in communication, computing, and consumer electronic/industrial/automotive sectors. ASE Technology Holding Co., Ltd. was founded in 1984 and is based in Kaohsiung, Taiwan.